Chairperson & CEOHsiu-Lan Hsu
President & Representative DirectorTakashi Ishikawa
Creating the future from here
Our company originated from Toshiba Ceramics which transferred silicon wafer business from Toshiba Corporation in 1977.
We became independent from Toshiba group as a Covalent Materials by management buyout in 2006. In 2013, business transfer was made to Global Wafers a subsidiary of Sino American Silicon Products Inc in Taiwan then we became Global Wafers Japan.
In 2016, silicon wafer business of SunEdison which originated from Monsanto Electronic Material Company (MEMC) and has 60 years of history, joined the Global Wafers Group. In Japan, MEMC Japan, the Japanese plant of SunEdison joined group of Global Wafers Japan.
While advancement of IT and Energy-saving technology has become an essential to consider global warming and economic security, advanced semiconductor which is core of these technologies continues pursue further high integration, high speed and low power consumption. The Silicon wafer that used as substrate of semiconductor require continuous technological innovation and quality improvement.
To respond customer needs, we combine the professionalism and teamwork that have cultivated since the days of TOSHIBA Ceramics and MEMC with cutting-edge technology of the time and providing high-quality products through continuous management innovation.
We will continue to push forward with our business to solidify our position as a global player in the industry.
GlobalWafers Japan Co., Ltd.
Chairperson & CEO: Hsiu-Lan Hsu
President & Representative Director: Takashi Ishikawa